- MAGIC RESIN CARRIER PROCESS - DAISHIO DENSHI

No need for heat resistant tapes.

Please FPC on Magic Resin Carrier and improve the mounting effiency - you save money.

 

Magic Resin Carrier for Thin PCB

New Process(Leave the cursor on to change images.)

1. Set the removal plate on the fixture with alignment pins

2. Set the FPC on the removal plate and fixture.

3. Set the Magic Resin carrier for the FPC ,removal plate and fixture

4. Remove the fixture with alignment pins

5. Revers

6. Take off the removal plate

7.Complete the FPC  setting on the Magic Resin Carrier

8.Set to the SMT mounting machine

9. Easily removing the FPC from Magic Resin carrier after the re flow soldering.

 

Specialty
• Magic Resin carrier has special adhesive capability.

• No heat-resistant taping required.
• No after treatment remains of adhesive required.